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1 Ergebnisse
1
High-Performance Thermal Interface Material with A Radial F..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhang, Jingjing
;
Liu, Daoqing
;
Zeng, Jianhui
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492391
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
High-Performance Thermal Interface Material with A Radial Filler Skeleton
UL https://suche.suub.uni-bremen.de/peid=ieee-10492391&Exemplar=1&LAN=DE A1 Zhang, Jingjing A1 Liu, Daoqing A1 Zeng, Jianhui A1 Zeng, Xiaoliang A1 Xu, Jian-Bin A1 Yao, Yimin A1 Sun, Rong YR 2023 SN 2836-9734 K1 Casting K1 Composite materials K1 Silicon carbide K1 Nanocomposites K1 Phonons K1 Conductivity K1 Electronic packaging thermal management K1 thermal interface materials K1 freeze-casting K1 silicon carbide nanowire K1 polymer composite SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492391 DO https://doi.org/10.1109/ICEPT59018.2023.10492391 SF ELIB - SuUB Bremen
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