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Failure Analysis and Modeling of Blind Vias Crack in BGA-PC..:

, In: 2023 24th International Conference on Electronic Packaging Technology (ICEPT),
Shi, Ying ; Yang, Shaohua ; Wu, Fugen. - p. 1-4 , 2023
Link: https://doi.org/10.1109/ICEPT59018.2023.10492404