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1 Ergebnisse
1
Stress-strain analysis and optimization of laminated solder..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Wu, Liye
;
Huang, Chunyue
;
Liu, Xiaobin
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492411
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Stress-strain analysis and optimization of laminated solder joints under random vibration load based on Taguchi and grey correlation method</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492411&Exemplar=1&LAN=DE A1 Wu, Liye A1 Huang, Chunyue A1 Liu, Xiaobin A1 Wang, Lilin A1 Liu, Xianjia A1 Zhang, Huaiquan YR 2023 SN 2836-9734 K1 Vibrations K1 Correlation K1 Welding K1 Structural engineering K1 Reliability K1 Soldering K1 Stress K1 Laminated solder joints K1 Random vibration K1 Grey correlation method SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492411 DO https://doi.org/10.1109/ICEPT59018.2023.10492411 SF ELIB - SuUB Bremen
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