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1 Ergebnisse
1
A low-cost spin-on-glass (SOG) liner deposited by vacuum-as..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Xuyan
;
Ding, Yingtao
;
Zhang, Ziyue
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492420
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A low-cost spin-on-glass (SOG) liner deposited by vacuum-assisted spin coating technique for via-last ultra-high aspect ratio through-silicon vias</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492420&Exemplar=1&LAN=DE A1 Chen, Xuyan A1 Ding, Yingtao A1 Zhang, Ziyue A1 Xiao, Lei A1 Wang, Han A1 Chen, Zhiming YR 2023 SN 2836-9734 K1 Silicon compounds K1 Morphology K1 Vacuum technology K1 Solids K1 Silicon K1 Oxidation K1 Spinning K1 through-silicon vias (TSVs) K1 ultra-high aspect ratio (UHAR) K1 spin-on-glass (SOG) K1 vacuum-assisted spin coating (VASC) technique K1 low-cost K1 via-last SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492420 DO https://doi.org/10.1109/ICEPT59018.2023.10492420 SF ELIB - SuUB Bremen
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