I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Enhanced Thermal Conductivity of Epoxy Adhesive Films by Fi..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Xu, Yuping
;
Xu, PengPeng
;
Li, Peng
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492427
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Enhanced Thermal Conductivity of Epoxy Adhesive Films by Filling Surface-Modified AlN</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492427&Exemplar=1&LAN=DE A1 Xu, Yuping A1 Xu, PengPeng A1 Li, Peng A1 Ma, Peilin A1 Yang, Jie A1 Chu, Baojin A1 Luo, Suibin A1 Yu, Shuhui YR 2023 SN 2836-9734 K1 Thermal expansion K1 Thermomechanical processes K1 Conductivity K1 Electronic packaging thermal management K1 Thermal conductivity K1 Thermal management K1 III-V semiconductor materials K1 Epoxy K1 Aluminum Nitride K1 Thermal Conductivity K1 Surface modification SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492427 DO https://doi.org/10.1109/ICEPT59018.2023.10492427 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
