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1 Ergebnisse
1
Effects of additive interactions on electroplating profile ..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Xiao
;
Li, Zhe
;
Gao, Li-Yin
.. - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492428
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Effects of additive interactions on electroplating profile of IC substrate copper pillars
UL https://suche.suub.uni-bremen.de/peid=ieee-10492428&Exemplar=1&LAN=DE A1 Li, Xiao A1 Li, Zhe A1 Gao, Li-Yin A1 Sun, Rong A1 Liu, Zhi-Quan YR 2023 SN 2836-9734 K1 Electrochemical deposition K1 Additives K1 Three-dimensional displays K1 System-in-package K1 Adsorption K1 Sodium K1 Copper K1 Copper pillars K1 high-speed electroplating K1 surface profiles K1 additive interactions SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492428 DO https://doi.org/10.1109/ICEPT59018.2023.10492428 SF ELIB - SuUB Bremen
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