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1
Research on Structure Reliability Design Technology of High..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Yang, Zhen-tao
;
Chen, Jiang-tao
;
Yu, Fei
. - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492429
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Research on Structure Reliability Design Technology of High Power Ceramic Based Microsystem package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492429&Exemplar=1&LAN=DE A1 Yang, Zhen-tao A1 Chen, Jiang-tao A1 Yu, Fei A1 Wang, De-jian YR 2023 SN 2836-9734 K1 Micromechanical devices K1 Thermal expansion K1 Systematics K1 Reliability engineering K1 Electronic packaging thermal management K1 Ceramics K1 Software reliability K1 Microsystems K1 Multi-layer co-fired ceramic K1 Coefficient of thermal expansion K1 Structural reliability SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492429 DO https://doi.org/10.1109/ICEPT59018.2023.10492429 SF ELIB - SuUB Bremen
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