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1 Ergebnisse
1
Improve the high-temperature reliability of epoxy encapsula..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Zhao, Shuaijie
;
Chen, Chuantong
;
Haga, Motoharu
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492432
RT T1
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
: T1
Improve the high-temperature reliability of epoxy encapsulation with copper substrates through a copper thiolate complex layer
UL https://suche.suub.uni-bremen.de/peid=ieee-10492432&Exemplar=1&LAN=DE A1 Zhao, Shuaijie A1 Chen, Chuantong A1 Haga, Motoharu A1 Ueshima, Minoru A1 Suzuki, Hirose A1 Takenaka, Hiroto A1 Suganuma, Katsuaki YR 2023 SN 2836-9734 K1 Encapsulation K1 Degradation K1 Wires K1 Oxidation K1 Copper K1 Reliability K1 Bonding K1 component K1 formatting K1 style K1 styling K1 insert SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492432 DO https://doi.org/10.1109/ICEPT59018.2023.10492432 SF ELIB - SuUB Bremen
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