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1 Ergebnisse
1
Application of ANSYS Sherlock in the fatigue lifetime evalu..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Yang, Mengke
;
Li, Qiuxi
;
Wang, Xiaowei
... - p. 1-5 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492433
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Application of ANSYS Sherlock in the fatigue lifetime evaluation of board level solder joint</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492433&Exemplar=1&LAN=DE A1 Yang, Mengke A1 Li, Qiuxi A1 Wang, Xiaowei A1 Chen, Zhiyun A1 Jiang, Xiaoying A1 Zhang, Queenie Zheng A1 Tan, Biao YR 2023 SN 2836-9734 K1 Thermal expansion K1 Simulation K1 Printed circuits K1 Telecommunication traffic K1 Fatigue K1 Finite element analysis K1 Software reliability K1 ANSYS Sherlock K1 Solder joints K1 Board level package K1 Lifetime evaluation K1 Finite element method SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492433 DO https://doi.org/10.1109/ICEPT59018.2023.10492433 SF ELIB - SuUB Bremen
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