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1 Ergebnisse
1
Simulation Study on Temperature Field of Packaged High Powe..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Liao, Hui
;
Song, Chunyan
;
Yang, Ningxuan
... - p. 1-3 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492440
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Simulation Study on Temperature Field of Packaged High Power GaN Laser Diodes</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492440&Exemplar=1&LAN=DE A1 Liao, Hui A1 Song, Chunyan A1 Yang, Ningxuan A1 Wang, Rui A1 Tang, Guanghui A1 Ji, Hongyu YR 2023 SN 2836-9734 K1 Heating systems K1 Performance evaluation K1 Semiconductor lasers K1 Simulation K1 Diode lasers K1 Semiconductor diodes K1 Reliability K1 GaN Laser Diodes K1 Temperature Field SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492440 DO https://doi.org/10.1109/ICEPT59018.2023.10492440 SF ELIB - SuUB Bremen
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