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1 Ergebnisse
1
A Novel Liner Formation Strategy for Double-sided Through-s..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Hao, Yigang
;
Ding, Yingtao
;
Yang, Baoyan
... - p. 1-4 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492443
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Novel Liner Formation Strategy for Double-sided Through-silicon-via (TSV) Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492443&Exemplar=1&LAN=DE A1 Hao, Yigang A1 Ding, Yingtao A1 Yang, Baoyan A1 Pan, Xingling A1 Chen, Zhiming A1 Zhang, Ziyue YR 2023 SN 2836-9734 K1 Viscosity K1 Insulation K1 Process control K1 Vacuum technology K1 Complexity theory K1 Spinning K1 Reliability K1 Through-silicon-via (TSV) K1 polyimide (PI) liner K1 double-sided process K1 spin-coating technique K1 chemical mechanical polishing (CMP) SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492443 DO https://doi.org/10.1109/ICEPT59018.2023.10492443 SF ELIB - SuUB Bremen
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