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1 Ergebnisse
1
Influence of voids in solder layer on the reliability of th..:
, In:
2023 24th International Conference on Electronic Packaging Technology (ICEPT)
,
Jiang, Danlei
;
Zhou, Longzao
;
Wu, Fengshun
... - p. 1-6 , 2023
Link:
https://doi.org/10.1109/ICEPT59018.2023.10492445
RT T1 <cTitle>2023 24th International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Influence of voids in solder layer on the reliability of the IGBT die attached interconnection under temperature shock</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10492445&Exemplar=1&LAN=DE A1 Jiang, Danlei A1 Zhou, Longzao A1 Wu, Fengshun A1 Ding, Liguo A1 Li, Kewei A1 Li, Xuemin YR 2023 SN 2836-9734 K1 Insulated gate bipolar transistors K1 Solid modeling K1 Temperature distribution K1 Electric shock K1 Fatigue K1 Plastics K1 Reliability K1 die attach structure of IGBT K1 voids in solder layer K1 thermal stress simulation K1 reliability of temperature shocks SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT59018.2023.10492445 DO https://doi.org/10.1109/ICEPT59018.2023.10492445 SF ELIB - SuUB Bremen
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