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1 Ergebnisse
1
Stress-Strain Model in Plated Through-Holes of Multilayer P..:
, In:
2023 3rd International Conference on Electrical Engineering and Control Science (IC2ECS)
,
Mou, Haowen
;
Ning, Weiwei
;
Qin, Xiaomeng
. - p. 356-365 , 2023
Link:
https://doi.org/10.1109/IC2ECS60824.2023.10493653
RT T1 <cTitle>2023 3rd International Conference on Electrical Engineering and Control Science (IC2ECS)</cTitle>: T1 <Title>Stress-Strain Model in Plated Through-Holes of Multilayer Printed Circuit Boards</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10493653&Exemplar=1&LAN=DE A1 Mou, Haowen A1 Ning, Weiwei A1 Qin, Xiaomeng A1 Lin, Dan YR 2023 K1 Analytical models K1 Temperature K1 Printed circuits K1 Nonhomogeneous media K1 Reliability engineering K1 Mathematical models K1 Finite element analysis K1 Stress-Strain Model K1 MBPTH SP 356 OP 365 LK http://dx.doi.org/https://doi.org/10.1109/IC2ECS60824.2023.10493653 DO https://doi.org/10.1109/IC2ECS60824.2023.10493653 SF ELIB - SuUB Bremen
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