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1 Ergebnisse
1
Stress Reduction by Indirect Bonding Configuration:
, In:
2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)
,
Lee, Shih-Wei
;
Wang, Chao-Shiun
- p. 1-3 , 2024
Link:
https://doi.org/10.1109/INERTIAL60399.2024.10502047
RT T1
2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL)
: T1
Stress Reduction by Indirect Bonding Configuration
UL https://suche.suub.uni-bremen.de/peid=ieee-10502047&Exemplar=1&LAN=DE A1 Lee, Shih-Wei A1 Wang, Chao-Shiun YR 2024 SN 2377-3480 K1 Accelerometers K1 Micromechanical devices K1 Inertial sensors K1 Bonding K1 Stress K1 stress K1 offset K1 accelerometer K1 anchor SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/INERTIAL60399.2024.10502047 DO https://doi.org/10.1109/INERTIAL60399.2024.10502047 SF ELIB - SuUB Bremen
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