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On-Chip Cross-Layer Infrastructure to Leverage System Relia..:
, In:
2024 27th International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS)
,
Vargas, Fabian Luis
- p. 116-117 , 2024
Link:
https://doi.org/10.1109/DDECS60919.2024.10508909
RT T1 <cTitle>2024 27th International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS)</cTitle>: T1 <Title>On-Chip Cross-Layer Infrastructure to Leverage System Reliability for Aero-Space Applications: Embedded Tutorial</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10508909&Exemplar=1&LAN=DE A1 Vargas, Fabian Luis YR 2024 SN 2473-2117 K1 Degradation K1 Cross layer design K1 Embedded systems K1 Single event upsets K1 Silicon K1 System-on-chip K1 Sensors K1 On-chip sensor K1 in-field monitoring K1 cross-layer resilience K1 on-chip analytics K1 Silicon lifecycle management (SLM) SP 116 OP 117 LK http://dx.doi.org/https://doi.org/10.1109/DDECS60919.2024.10508909 DO https://doi.org/10.1109/DDECS60919.2024.10508909 SF ELIB - SuUB Bremen
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