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1 Ergebnisse
1
A High-reliability SiC-based Power Module with High-Tempera..:
, In:
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Liu, Baihan
;
Lv, Jianwei
;
Yan, Yiyang
... - p. 2551-2555 , 2024
Link:
https://doi.org/10.1109/APEC48139.2024.10509025
RT T1 <cTitle>2024 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>A High-reliability SiC-based Power Module with High-Temperature Co-fired Ceramic Interposer for High-temperature Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10509025&Exemplar=1&LAN=DE A1 Liu, Baihan A1 Lv, Jianwei A1 Yan, Yiyang A1 Du, Mengyao A1 Zhang, Yifan A1 Chen, Cai A1 Liu, Jiaxin A1 Kang, Yong A1 Yu, Chenjiang A1 Wang, Min YR 2024 SN 2470-6647 K1 Inductance K1 Temperature K1 Thermal resistance K1 Wires K1 Multichip modules K1 Thermal conductivity K1 Silicon K1 silicon carbide K1 power module K1 high-temperature packaging K1 power electronics packaging SP 2551 OP 2555 LK http://dx.doi.org/https://doi.org/10.1109/APEC48139.2024.10509025 DO https://doi.org/10.1109/APEC48139.2024.10509025 SF ELIB - SuUB Bremen
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