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1 Ergebnisse
1
Development of Pressure Contact Technology for Multi-chip S..:
, In:
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Wang, Lei
;
Wang, Wenbo
;
Rietveld, Gert.
. - p. 202-209 , 2024
Link:
https://doi.org/10.1109/APEC48139.2024.10509116
RT T1 <cTitle>2024 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>Development of Pressure Contact Technology for Multi-chip SiC Modules with Low Parasitics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10509116&Exemplar=1&LAN=DE A1 Wang, Lei A1 Wang, Wenbo A1 Rietveld, Gert. A1 Hueting, Raymond J.E. YR 2024 SN 2470-6647 K1 Power system measurements K1 Silicon carbide K1 Contacts K1 Prototypes K1 Switches K1 Packaging K1 Logic gates K1 pressure contact packaging K1 silicon carbide K1 power module K1 stray inductance K1 current balance SP 202 OP 209 LK http://dx.doi.org/https://doi.org/10.1109/APEC48139.2024.10509116 DO https://doi.org/10.1109/APEC48139.2024.10509116 SF ELIB - SuUB Bremen
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