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1 Ergebnisse
1
FET Junction Temperature Monitoring Using Novel On-Chip Sol..:
, In:
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Narwal, Ramandeep
;
Agarwal, Aditi
;
Cheng, Tzu-Hsuan
... - p. 2475-2482 , 2024
Link:
https://doi.org/10.1109/APEC48139.2024.10509157
RT T1 <cTitle>2024 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>FET Junction Temperature Monitoring Using Novel On-Chip Solution</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10509157&Exemplar=1&LAN=DE A1 Narwal, Ramandeep A1 Agarwal, Aditi A1 Cheng, Tzu-Hsuan A1 Baliga, B. Jayant A1 Bhattacharya, Subhashish A1 Hopkins, Douglas C. YR 2024 SN 2470-6647 K1 Temperature sensors K1 Temperature measurement K1 Resistors K1 Performance evaluation K1 Temperature distribution K1 MOSFET K1 Silicon carbide K1 Bidirectional switches K1 SiC bidirectional FET K1 BiDFET K1 Junction Temperature K1 MOS Power devices K1 Silicon Carbide K1 Temperature sensing SP 2475 OP 2482 LK http://dx.doi.org/https://doi.org/10.1109/APEC48139.2024.10509157 DO https://doi.org/10.1109/APEC48139.2024.10509157 SF ELIB - SuUB Bremen
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