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1 Ergebnisse
1
Impact of Bond Wire Degradation on Thermal Estimation and T..:
, In:
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Zhang, Yichi
;
Zhang, Yi
;
Yao, Bo
. - p. 2443-2447 , 2024
Link:
https://doi.org/10.1109/APEC48139.2024.10509199
RT T1 <cTitle>2024 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>Impact of Bond Wire Degradation on Thermal Estimation and Temperature Coefficient of IGBT Modules in Power Cycling Test</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10509199&Exemplar=1&LAN=DE A1 Zhang, Yichi A1 Zhang, Yi A1 Yao, Bo A1 Wang, Huai YR 2024 SN 2470-6647 K1 Temperature sensors K1 Degradation K1 Temperature measurement K1 Temperature dependence K1 Temperature K1 Wires K1 Aging K1 bond wire K1 degradation characterization K1 IGBT K1 power cycling test K1 on-state voltage K1 temperature decoupling SP 2443 OP 2447 LK http://dx.doi.org/https://doi.org/10.1109/APEC48139.2024.10509199 DO https://doi.org/10.1109/APEC48139.2024.10509199 SF ELIB - SuUB Bremen
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