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1 Ergebnisse
1
A Compact Vertically Stacked Converter Module with Thermal ..:
, In:
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Liang, Jingyuan
;
Liu, Qi
;
Liu, Tiantian
. - p. 1855-1860 , 2024
Link:
https://doi.org/10.1109/APEC48139.2024.10509200
RT T1 <cTitle>2024 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>A Compact Vertically Stacked Converter Module with Thermal Balancing and High-Power Dissipation Capability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10509200&Exemplar=1&LAN=DE A1 Liang, Jingyuan A1 Liu, Qi A1 Liu, Tiantian A1 Ng, Wai Tung YR 2024 SN 2470-6647 K1 Temperature measurement K1 MOSFET K1 Temperature distribution K1 Buck converters K1 Cooling K1 Thermal resistance K1 Layout K1 copper core PCB K1 pad-to-core connection K1 vertical packaging K1 3D packaging K1 thermal balancing K1 high-power dissipation capability K1 topside-cooled VDMOS K1 chip-on-chip structure SP 1855 OP 1860 LK http://dx.doi.org/https://doi.org/10.1109/APEC48139.2024.10509200 DO https://doi.org/10.1109/APEC48139.2024.10509200 SF ELIB - SuUB Bremen
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