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1
Thermal Modeling of E-Mode GaN HEMTs under Wide-Range Therm..:
, In:
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Sayed, Hussain
;
Krishnamoorthy, Harish S.
- p. 1861-1866 , 2024
Link:
https://doi.org/10.1109/APEC48139.2024.10509209
RT T1 <cTitle>2024 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>Thermal Modeling of E-Mode GaN HEMTs under Wide-Range Thermal Cycling Tests</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10509209&Exemplar=1&LAN=DE A1 Sayed, Hussain A1 Krishnamoorthy, Harish S. YR 2024 SN 2470-6647 K1 Temperature sensors K1 Temperature measurement K1 Thermistors K1 HEMTs K1 Electronic packaging thermal management K1 Thermal analysis K1 Gallium nitride K1 Gallium Nitride (GaN) devices K1 thermal modeling K1 thermal runaway K1 junction temperature monitoring K1 Foster thermal modeling K1 and accelerated thermal cycling SP 1861 OP 1866 LK http://dx.doi.org/https://doi.org/10.1109/APEC48139.2024.10509209 DO https://doi.org/10.1109/APEC48139.2024.10509209 SF ELIB - SuUB Bremen
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