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1 Ergebnisse
1
SymCool™ B-TRAN™ Power Module Design Considerations and Cha..:
, In:
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Dong, Mouzhi
;
Khanna, Mudit
;
Yu, Ruiyang
... - p. 1867-1871 , 2024
Link:
https://doi.org/10.1109/APEC48139.2024.10509359
RT T1 <cTitle>2024 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>SymCool™ B-TRAN™ Power Module Design Considerations and Characterization</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10509359&Exemplar=1&LAN=DE A1 Dong, Mouzhi A1 Khanna, Mudit A1 Yu, Ruiyang A1 Jiang, Yifan A1 Templeton, Joseph A1 Bu, Jiankang A1 Knapp, Jeffrey A1 Brdar, Daniel YR 2024 SN 2470-6647 K1 Performance evaluation K1 Thermal expansion K1 Surface resistance K1 Multichip modules K1 Switches K1 Solids K1 Foundries K1 Bidirectional Switch K1 Double-Sided Cooling K1 Back-to-Back Transistors K1 Double-Sided Wafer Fabrication K1 Solid-State Circuit Breakers K1 and Matrix Converters SP 1867 OP 1871 LK http://dx.doi.org/https://doi.org/10.1109/APEC48139.2024.10509359 DO https://doi.org/10.1109/APEC48139.2024.10509359 SF ELIB - SuUB Bremen
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