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1 Ergebnisse
1
Low Inductance Package with Multi-layer PCB Wiring for Doub..:
, In:
2024 IEEE Applied Power Electronics Conference and Exposition (APEC)
,
Asai, Kyota
;
Tokuyama, Takeshi
;
Araki, Takahiro
... - p. 2488-2493 , 2024
Link:
https://doi.org/10.1109/APEC48139.2024.10509457
RT T1 <cTitle>2024 IEEE Applied Power Electronics Conference and Exposition (APEC)</cTitle>: T1 <Title>Low Inductance Package with Multi-layer PCB Wiring for Double-sided Direct Oil-cooling Inverter</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10509457&Exemplar=1&LAN=DE A1 Asai, Kyota A1 Tokuyama, Takeshi A1 Araki, Takahiro A1 Namba, Akihiro A1 Chen, Ti A1 Tanaka, Shintaro YR 2024 SN 2470-6647 K1 Wiring K1 Heating systems K1 Inductance K1 Cooling K1 Thermal resistance K1 Printed circuits K1 Snubbers K1 In-wheel system K1 Inverter K1 Printed circuit board K1 Oil-cooling SP 2488 OP 2493 LK http://dx.doi.org/https://doi.org/10.1109/APEC48139.2024.10509457 DO https://doi.org/10.1109/APEC48139.2024.10509457 SF ELIB - SuUB Bremen
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