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1 Ergebnisse
1
High Temperature Mechanical Properties of Nano-twinned Copp..:
, In:
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Parween, Gulnaz
;
Chen, Bo-Yan
;
Tran, Dinh-Phuc
.. - p. 1-3 , 2024
Link:
https://doi.org/10.1109/EDTM58488.2024.10511414
RT T1 <cTitle>2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</cTitle>: T1 <Title>High Temperature Mechanical Properties of Nano-twinned Copper</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10511414&Exemplar=1&LAN=DE A1 Parween, Gulnaz A1 Chen, Bo-Yan A1 Tran, Dinh-Phuc A1 Chen, Chih A1 Badwe, Nilesh YR 2024 K1 Temperature K1 Thermomechanical processes K1 Packaging K1 Fatigue K1 Manufacturing K1 Softening K1 Copper K1 Nanotwinned Cu K1 High temperature tensile testing K1 Mechanical properties K1 Cu-Cu bonding K1 Interconnect materials SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDTM58488.2024.10511414 DO https://doi.org/10.1109/EDTM58488.2024.10511414 SF ELIB - SuUB Bremen
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