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1 Ergebnisse
1
Optimization of Tungsten Plug Thin Film Process to Improve ..:
, In:
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Chauhan, A.K.
;
Teja, V.S.
;
Chawla, P.
... - p. 1-3 , 2024
Link:
https://doi.org/10.1109/EDTM58488.2024.10511484
RT T1 <cTitle>2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</cTitle>: T1 <Title>Optimization of Tungsten Plug Thin Film Process to Improve the Fill Seam and Contact Resistance in 180nm CMOS Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10511484&Exemplar=1&LAN=DE A1 Chauhan, A.K. A1 Teja, V.S. A1 Chawla, P. A1 Sharma, A.K. A1 Attri, R. A1 Gupta, M. A1 Singh, M.K. A1 Wadhwa, M. YR 2024 K1 Tungsten K1 Production K1 Contact resistance K1 CMOS technology K1 Manufacturing K1 Electrical resistance measurement K1 Standards K1 thin film K1 W plug K1 aspect ratio K1 step-coverage K1 Seam K1 CMP K1 metal CVD K1 contact resistance K1 X-SEM SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDTM58488.2024.10511484 DO https://doi.org/10.1109/EDTM58488.2024.10511484 SF ELIB - SuUB Bremen
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