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Trade-off Between Thermal Budget and Thickness Scaling: A B..:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Chiu, Chui-Yi ; De, Sourav ; Cho, Chen-Yi. - p. 1-3 , 2024
Link: https://doi.org/10.1109/EDTM58488.2024.10511710