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1 Ergebnisse
1
Thermal Impedance Model for Multifinger SiGe HBTs:
, In:
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Pande, Shubham
;
K, Nidhin
;
Balanethiram, Suresh
.. - p. 1-3 , 2024
Link:
https://doi.org/10.1109/EDTM58488.2024.10511757
RT T1 <cTitle>2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</cTitle>: T1 <Title>Thermal Impedance Model for Multifinger SiGe HBTs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10511757&Exemplar=1&LAN=DE A1 Pande, Shubham A1 K, Nidhin A1 Balanethiram, Suresh A1 Yadav, Shon A1 Chakravorty, Anjan YR 2024 K1 Couplings K1 Computational modeling K1 Thermal resistance K1 Fingers K1 Data models K1 Impedance K1 Transient analysis K1 SiGe HBTs K1 self-heating K1 thermal resistance K1 thermal capacitance K1 electrothermal effect K1 transient model SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDTM58488.2024.10511757 DO https://doi.org/10.1109/EDTM58488.2024.10511757 SF ELIB - SuUB Bremen
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