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Effect of collet on the die stress during die pick-up:

, In: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM),
Palli, Siva Sai Kishore ; Vempaty, Venkata Rama Satya Pradeep ; Sim, Wen How. - p. 1-3 , 2024
Link: https://doi.org/10.1109/EDTM58488.2024.10511891