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1 Ergebnisse
1
Prepreg-based FCBGA for Advanced Packaging Substrate:
, In:
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
,
Kang, Byoung-Phil
;
Lee, Ken
;
Kim, Jaesung
. - p. 1-3 , 2024
Link:
https://doi.org/10.1109/EDTM58488.2024.10511988
RT T1 <cTitle>2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)</cTitle>: T1 <Title>Prepreg-based FCBGA for Advanced Packaging Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10511988&Exemplar=1&LAN=DE A1 Kang, Byoung-Phil A1 Lee, Ken A1 Kim, Jaesung A1 Lee, Jong-Yun YR 2024 K1 Fabrication K1 Additives K1 Glass K1 Packaging K1 Market research K1 Mechanical factors K1 Laminates K1 FCBGA K1 Prepreg K1 ABF K1 DIC K1 and Warpage SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/EDTM58488.2024.10511988 DO https://doi.org/10.1109/EDTM58488.2024.10511988 SF ELIB - SuUB Bremen
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