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1 Ergebnisse
1
Test Structure to Assess Bump Shape Influence on Hybrid Bon..:
, In:
2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS)
,
Mizushima, Ayako
;
Misumi, Kei
;
Yasunaga, Shun
... - p. 1-4 , 2024
Link:
https://doi.org/10.1109/ICMTS59902.2024.10520685
RT T1 <cTitle>2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS)</cTitle>: T1 <Title>Test Structure to Assess Bump Shape Influence on Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10520685&Exemplar=1&LAN=DE A1 Mizushima, Ayako A1 Misumi, Kei A1 Yasunaga, Shun A1 Higo, Akio A1 Nakane, Ryosho A1 Tsumura, Kazumichi A1 Higashi, Kazuyuki A1 Ochiai, Yukinori A1 Mita, Yoshio YR 2024 SN 2158-1029 K1 Gold K1 Shape K1 Surface morphology K1 Morphology K1 Reliability engineering K1 Microelectronics K1 Bonding K1 bump shape K1 flip chip bonding K1 test structure SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICMTS59902.2024.10520685 DO https://doi.org/10.1109/ICMTS59902.2024.10520685 SF ELIB - SuUB Bremen
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