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Making Accurate and Consistent Wafer Measurements with Next..:

, In: 2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS),

Sia, Choon Beng ; Funatoko, Yoichi ; Kunioka, Isao... - p. 1-5 , 2024

Link: https://doi.org/10.1109/ICMTS59902.2024.10520687

RT 
T1 <cTitle>2024 IEEE 36th International Conference on Microelectronic Test Structures (ICMTS)</cTitle>: T1 <Title>Making Accurate and Consistent Wafer Measurements with Next Generation Guarded True-Kelvin MEMS DC Probes</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10520687&Exemplar=1&LAN=DE
				
A1 Sia, Choon Beng
A1 Funatoko, Yoichi
A1 Kunioka, Isao
A1 Watanabe, Masanori
A1 Andrews, Peter
A1 Dawson, Ken
A1 Sameshima, Masahiro
A1 Saeki, Takao
A1 Yang, John
A1 Li, Jesse
A1 Li, Xiaoyu
A1 Guo, Siming
A1 Fan, Li
A1 Lim, Wei Meng
A1 Wilcox, Eric
A1 Lord, Anthony
A1 Lastella, Sarah
A1 Kawamata, Nobuhiro
A1 Klattenhoff, Jens
A1 Kister, Jarek
A1 Losey, Matt
A1 Slessor, Mike
YR 2024
SN 2158-1029
K1 Semiconductor device modeling
K1 Micromechanical devices
K1 Resistance
K1 Performance evaluation
K1 Force measurement
K1 Production
K1 Electrical resistance measurement
K1 Device modeling
K1 DC
K1 CV
K1 flicker noise
K1 probe
K1 MEMS probe
K1 true-Kelvin probe
K1 quasi-Kelvin probe
K1 Kelvin
K1 wafer measurements
K1 contact resistance
SP 1
OP 5
LK http://dx.doi.org/https://doi.org/10.1109/ICMTS59902.2024.10520687
DO https://doi.org/10.1109/ICMTS59902.2024.10520687
SF ELIB - SuUB Bremen

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