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1 Ergebnisse
1
Self-Heating Effect of Device-Circuit with Back-side Power ..:
, In:
2024 IEEE International Reliability Physics Symposium (IRPS)
,
Zhao, Pan
;
Xu, Jinghan
;
Zhou, Taoyu
... - p. 1-6 , 2024
Link:
https://doi.org/10.1109/IRPS48228.2024.10529350
RT T1 <cTitle>2024 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Self-Heating Effect of Device-Circuit with Back-side Power Delivery Network beyond 3nm Node</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10529350&Exemplar=1&LAN=DE A1 Zhao, Pan A1 Xu, Jinghan A1 Zhou, Taoyu A1 Zhao, Songhan A1 Liu, Naiqi A1 Li, Xinpeng A1 He, Yandong A1 Liu, Xiaoyan A1 Du, Gang YR 2024 SN 1938-1891 K1 Performance evaluation K1 Circuit optimization K1 Circuits K1 Random access memory K1 Voltage K1 Thermal conductivity K1 Power system reliability K1 Self-Heating Effect (SHE) K1 Backside Power Delivery Network (BSPDN) K1 3nm technology nodes K1 Thermal network model K1 Power Performance Area Thermal (PP AT) SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48228.2024.10529350 DO https://doi.org/10.1109/IRPS48228.2024.10529350 SF ELIB - SuUB Bremen
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