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Thermal Performance Evaluation of Multi-Core SOCs Using Pow..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),

Mishra, S. ; Vermeersch, B. ; Sankatali, V.... - p. 1-6 , 2024

Link: https://doi.org/10.1109/IRPS48228.2024.10529355

RT 
T1 <cTitle>2024 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10529355&Exemplar=1&LAN=DE
				
A1 Mishra, S.
A1 Vermeersch, B.
A1 Sankatali, V.
A1 Kukner, H.
A1 Sharma, A.
A1 Mirabeli, G.
A1 Bufler, F. M.
A1 Brunion, M.
A1 Abdi, D.
A1 Oprins, H.
A1 Biswas, D.
A1 Zografos, O.
A1 Catthoor, F.
A1 Weckx, P.
A1 Hellings, G.
A1 Myers, J.
A1 Ryckaert, J.
YR 2024
SN 1938-1891
K1 Performance evaluation
K1 Temperature sensors
K1 Temperature dependence
K1 Cooling
K1 Packaging
K1 System-on-chip
K1 Thermal analysis
K1 CMOS
K1 cooling
K1 leakage power
K1 nanosheet
K1 packaging
K1 power density
K1 power-thermal co-simulation
K1 self-consistency
K1 SOC
K1 system-on-chip
K1 temperature
K1 thermal analysis
SP 1
OP 6
LK http://dx.doi.org/https://doi.org/10.1109/IRPS48228.2024.10529355
DO https://doi.org/10.1109/IRPS48228.2024.10529355
SF ELIB - SuUB Bremen

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