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1 Ergebnisse
1
Impact of Hot Carrier Degradation and Bias Temperature Inst..:
, In:
2024 IEEE International Reliability Physics Symposium (IRPS)
,
Qu, Yiming
;
Yan, Chu
;
Ding, Yaru
. - p. 1-6 , 2024
Link:
https://doi.org/10.1109/IRPS48228.2024.10529378
RT T1 <cTitle>2024 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Impact of Hot Carrier Degradation and Bias Temperature Instability on GHz Cycle-to-Cycle Variation in Ultra-Scaled FinFETs</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10529378&Exemplar=1&LAN=DE A1 Qu, Yiming A1 Yan, Chu A1 Ding, Yaru A1 Zhao, Yi YR 2024 SN 1938-1891 K1 Temperature measurement K1 Temperature sensors K1 Degradation K1 Sensitivity K1 Thermal variables control K1 Hot carriers K1 FinFETs K1 Cyclic variation K1 Hot Carrier Degradation K1 Bias Temperature Instability K1 Ultra-fast Characterization SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48228.2024.10529378 DO https://doi.org/10.1109/IRPS48228.2024.10529378 SF ELIB - SuUB Bremen
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