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1 Ergebnisse
1
Thermo-Mechanical Reliability Characteristics of 8H HBM3:
, In:
2024 IEEE International Reliability Physics Symposium (IRPS)
,
Bae, Jinsoo
;
Noh, HG.
;
Yoo, SJ.
... - p. 1-6 , 2024
Link:
https://doi.org/10.1109/IRPS48228.2024.10529424
RT T1 <cTitle>2024 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Thermo-Mechanical Reliability Characteristics of 8H HBM3</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10529424&Exemplar=1&LAN=DE A1 Bae, Jinsoo A1 Noh, HG. A1 Yoo, SJ. A1 Choi, IJ. A1 Bae, GH. A1 Shim, YM. A1 Lee, SG. A1 Jang, H. A1 Lee, SM. A1 Chang, GH. A1 Kwon, KS. A1 Yoon, CB. A1 Lee, YS. A1 Pyun, JW. A1 Kim, JH. A1 Ko, SB. A1 Hwang, YC. A1 Pae, S. YR 2024 SN 1938-1891 K1 Thermomechanical processes K1 Random access memory K1 Thermal conductivity K1 Numerical simulation K1 Reliability K1 Through-silicon vias K1 Artificial intelligence K1 HBM K1 2.5D package K1 Thermo-mechanical SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48228.2024.10529424 DO https://doi.org/10.1109/IRPS48228.2024.10529424 SF ELIB - SuUB Bremen
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