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1 Ergebnisse
1
Electromigration Test Chip Experiments from Realistic Power..:
, In:
2024 IEEE International Reliability Physics Symposium (IRPS)
,
Yi, Yong Hyeon
;
Kim, Chris
;
Kteyan, Armen
... - p. 01-06 , 2024
Link:
https://doi.org/10.1109/IRPS48228.2024.10529449
RT T1 <cTitle>2024 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10529449&Exemplar=1&LAN=DE A1 Yi, Yong Hyeon A1 Kim, Chris A1 Kteyan, Armen A1 Volkov, Alexander A1 Moreau, Stephane A1 Sukharev, Valeriy YR 2024 SN 1938-1891 K1 Resistance K1 Rails K1 Electromigration K1 Tensile stress K1 Redundancy K1 Aging K1 Market research K1 power grid K1 BEOL K1 on-chip heater K1 reliability K1 void K1 TTF SP 01 OP 06 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48228.2024.10529449 DO https://doi.org/10.1109/IRPS48228.2024.10529449 SF ELIB - SuUB Bremen
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