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1 Ergebnisse
1
Thermal Analysis of High-Performance Server SoCs from FinFE..:
, In:
2024 IEEE International Reliability Physics Symposium (IRPS)
,
Kumar, Nitish
;
Sankatali, Venkateswarlu
;
Chen, Yukai
... - p. 8B.4-1-8B.4-8 , 2024
Link:
https://doi.org/10.1109/IRPS48228.2024.10529472
RT T1 <cTitle>2024 IEEE International Reliability Physics Symposium (IRPS)</cTitle>: T1 <Title>Thermal Analysis of High-Performance Server SoCs from FinFET to Nanosheet Technologies</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10529472&Exemplar=1&LAN=DE A1 Kumar, Nitish A1 Sankatali, Venkateswarlu A1 Chen, Yukai A1 Brunion, Moritz A1 Mishra, Subrat A1 Gupta, Ankur A1 Singh, Pushpapraj A1 Catthoor, Francky A1 Myers, James A1 Ryckaert, Julien A1 Biswas, Dwaipayan YR 2024 SN 1938-1891 K1 Heating systems K1 Printed circuits K1 Power distribution K1 Conductivity K1 Thermal conductivity K1 FinFETs K1 Thermal analysis K1 High-performance computing (HPC) K1 thermal reliability K1 cooling solution K1 TIM K1 BSPDN K1 hotspot K1 packaging K1 heterogeneous power K1 transient analysis SP 8B.4 OP 1-8B.4-8 LK http://dx.doi.org/https://doi.org/10.1109/IRPS48228.2024.10529472 DO https://doi.org/10.1109/IRPS48228.2024.10529472 SF ELIB - SuUB Bremen
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