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1 Ergebnisse
1
Advances and Reliability Challenges in Heterogeneous Integr..:
, In:
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
,
Wu, Zhuo-Jie
;
Xu, Nan
- p. 1-4 , 2024
Link:
https://doi.org/10.1109/CSTIC61820.2024.10531834
RT T1 <cTitle>2024 Conference of Science and Technology for Integrated Circuits (CSTIC)</cTitle>: T1 <Title>Advances and Reliability Challenges in Heterogeneous Integration in Chiplet ERA: From Solder to Copper to Optical Interconnects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10531834&Exemplar=1&LAN=DE A1 Wu, Zhuo-Jie A1 Xu, Nan YR 2024 K1 Optical interconnections K1 Integrated circuit interconnections K1 Multichip modules K1 Bridge circuits K1 Materials reliability K1 Silicon K1 Copper SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC61820.2024.10531834 DO https://doi.org/10.1109/CSTIC61820.2024.10531834 SF ELIB - SuUB Bremen
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