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1 Ergebnisse
1
Study on ELK Dielectric Reliability During the Solder Reflo..:
, In:
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
,
Zheng, Jialin
;
Zhao, Yunong
;
Wang, Zhuqiu
... - p. 1-4 , 2024
Link:
https://doi.org/10.1109/CSTIC61820.2024.10531870
RT T1 <cTitle>2024 Conference of Science and Technology for Integrated Circuits (CSTIC)</cTitle>: T1 <Title>Study on ELK Dielectric Reliability During the Solder Reflow Process Based on Finite Element Simulations</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10531870&Exemplar=1&LAN=DE A1 Zheng, Jialin A1 Zhao, Yunong A1 Wang, Zhuqiu A1 Lin, Shaobin A1 Yang, Dan A1 Mei, Na YR 2024 K1 Integrated circuits K1 Tensile stress K1 Dielectrics K1 Finite element analysis K1 Plastics K1 Thermal loading K1 Stress SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC61820.2024.10531870 DO https://doi.org/10.1109/CSTIC61820.2024.10531870 SF ELIB - SuUB Bremen
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