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Study on Failure Mechanism of C4 Bump Solder Excursion in C..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Wei, Xixiong ; Lin, Xinyi ; Zhou, Shilu.. - p. 1-3 , 2024
Link: https://doi.org/10.1109/CSTIC61820.2024.10531879