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1 Ergebnisse
1
ILD-CMP Wafer Edge Thickness Profile Stability Improvement ..:
, In:
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
,
Zhang, ZhiJie
;
Liang, Zhiyang
;
Wang, HongDi
. - p. 1-5 , 2024
Link:
https://doi.org/10.1109/CSTIC61820.2024.10531881
RT T1 <cTitle>2024 Conference of Science and Technology for Integrated Circuits (CSTIC)</cTitle>: T1 <Title>ILD-CMP Wafer Edge Thickness Profile Stability Improvement via Acid Silicon Oxide Slurry Formulation Design</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10531881&Exemplar=1&LAN=DE A1 Zhang, ZhiJie A1 Liang, Zhiyang A1 Wang, HongDi A1 Tian, Liang YR 2024 K1 Silicon compounds K1 Stability criteria K1 Process control K1 Production K1 Solids K1 Silicon K1 Abrasives K1 ILD CMP K1 Wafer Edge Thickness K1 Profile K1 Acid Silicon Oxide Slurry SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC61820.2024.10531881 DO https://doi.org/10.1109/CSTIC61820.2024.10531881 SF ELIB - SuUB Bremen
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