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Fea of Thermo-Mechanically Induced Cracks in IMD:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Chan, Colin ; Ching, Bong Ching ; Cheol, Kim Hyeon - p. 1-04 , 2024
Link: https://doi.org/10.1109/CSTIC61820.2024.10531960