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1 Ergebnisse
1
The Impact of Wafer Warpage-Induced Unevenness on Alignment:
, In:
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
,
Liu, Pan
;
Huang, Tianhao
;
Chen, Zeyang
... - p. 1-3 , 2024
Link:
https://doi.org/10.1109/CSTIC61820.2024.10531999
RT T1 <cTitle>2024 Conference of Science and Technology for Integrated Circuits (CSTIC)</cTitle>: T1 <Title>The Impact of Wafer Warpage-Induced Unevenness on Alignment</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10531999&Exemplar=1&LAN=DE A1 Liu, Pan A1 Huang, Tianhao A1 Chen, Zeyang A1 Ma, Chenhang A1 Wu, Jianming A1 Gao, Dawei A1 Zhou, Guodong YR 2024 K1 Semiconductor device modeling K1 Integrated circuits K1 Diffraction K1 Deformation K1 Lithography K1 Semiconductor device manufacture K1 Time-domain analysis SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC61820.2024.10531999 DO https://doi.org/10.1109/CSTIC61820.2024.10531999 SF ELIB - SuUB Bremen
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