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1 Ergebnisse
1
A Study of High Aspect Ratio Si Trench in Cycle Mode Etchin..:
, In:
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
,
Teng, Zhang
;
Hui, Qin
;
Litian, Xu
... - p. 1-2 , 2024
Link:
https://doi.org/10.1109/CSTIC61820.2024.10532051
RT T1 <cTitle>2024 Conference of Science and Technology for Integrated Circuits (CSTIC)</cTitle>: T1 <Title>A Study of High Aspect Ratio Si Trench in Cycle Mode Etching with Mask no Loss</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10532051&Exemplar=1&LAN=DE A1 Teng, Zhang A1 Hui, Qin A1 Litian, Xu A1 Xiaohui, Li A1 Zhongwei, Jiang A1 Jing, Wang YR 2024 K1 Integrated circuits K1 Semiconductor devices K1 Process control K1 Etching K1 Silicon K1 Plasmas K1 plasma etching K1 HAR K1 CH3F dep K1 cycle SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC61820.2024.10532051 DO https://doi.org/10.1109/CSTIC61820.2024.10532051 SF ELIB - SuUB Bremen
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