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1 Ergebnisse
1
Predicting Material Removal Rate in Chemical Mechanical Pol..:
, In:
2024 Conference of Science and Technology for Integrated Circuits (CSTIC)
,
Zuo, Jiahui
;
Chen, Zeyang
;
Cui, Yuanzheng
... - p. 1-3 , 2024
Link:
https://doi.org/10.1109/CSTIC61820.2024.10532078
RT T1 <cTitle>2024 Conference of Science and Technology for Integrated Circuits (CSTIC)</cTitle>: T1 <Title>Predicting Material Removal Rate in Chemical Mechanical Polishing (CMP) Using Explainable Machine Learning Methods</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10532078&Exemplar=1&LAN=DE A1 Zuo, Jiahui A1 Chen, Zeyang A1 Cui, Yuanzheng A1 Cheng, Yongpeng A1 Ma, Yitao A1 Chen, Huixin A1 Chen, Shaowei A1 Zhou, Guodong A1 Gao, Dawei YR 2024 K1 Semiconductor device modeling K1 Training K1 Additives K1 Planarization K1 Production K1 Predictive models K1 Prediction algorithms K1 chemical mechanical planarization K1 material remove rate K1 Explainable Machine Learning K1 XGBoost K1 SHAP SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/CSTIC61820.2024.10532078 DO https://doi.org/10.1109/CSTIC61820.2024.10532078 SF ELIB - SuUB Bremen
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