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A Study of the Effects of Thermal Budget on 3D-NAND Charge ..:
, In:
2024 IEEE Workshop on Microelectronics and Electron Devices (WMED)
,
Aoulaiche, Marc
;
Venkatesan, Srinath
;
Lee, Donghwa
... - p. 1-4 , 2024
Link:
https://doi.org/10.1109/WMED61554.2024.10534145
RT T1 <cTitle>2024 IEEE Workshop on Microelectronics and Electron Devices (WMED)</cTitle>: T1 <Title>A Study of the Effects of Thermal Budget on 3D-NAND Charge Trap Cell Reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10534145&Exemplar=1&LAN=DE A1 Aoulaiche, Marc A1 Venkatesan, Srinath A1 Lee, Donghwa A1 Sharbati, Mohammad Taghi A1 Nawaz, Seeraz A1 Jung, Kyubong YR 2024 SN 1947-3842 K1 Electron traps K1 Temperature K1 Films K1 Semiconductor device reliability K1 Stacking K1 Microelectronics K1 Electron devices K1 3D-NAND cell K1 charge trap K1 thermal budget SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/WMED61554.2024.10534145 DO https://doi.org/10.1109/WMED61554.2024.10534145 SF ELIB - SuUB Bremen
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