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1 Ergebnisse
1
Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Fre..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Zhou, Jiye
;
Tan, Xin F.
;
McDonald, Stuart D.
... - p. 81-82 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535431
RT T1
2024 International Conference on Electronics Packaging (ICEP)
: T1
Thermal Stability of Bi in Sn-Cu Based High Strength Pb-Free Solder Alloys
UL https://suche.suub.uni-bremen.de/peid=ieee-10535431&Exemplar=1&LAN=DE A1 Zhou, Jiye A1 Tan, Xin F. A1 McDonald, Stuart D. A1 Sweatman, Keith A1 Akaiwa, Tetsuya A1 Nogita, Kazuhiro YR 2024 K1 Heating systems K1 Temperature dependence K1 Scanning electron microscopy K1 Thermal expansion K1 Precipitation K1 Lattices K1 Bismuth K1 Electronics packaging K1 commercial Pb-free solder K1 solid solubility K1 thermal expansion SP 81 OP 82 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535431 DO https://doi.org/10.23919/ICEP61562.2024.10535431 SF ELIB - SuUB Bremen
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