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1 Ergebnisse
1
Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Las..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Han, Sang Eun
;
Han, Seonghui
;
Lee, Tae-Young
.. - p. 85-86 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535432
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Laser Assisted Bonding (LAB)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535432&Exemplar=1&LAN=DE A1 Han, Sang Eun A1 Han, Seonghui A1 Lee, Tae-Young A1 Lee, Hoo-Jeong A1 Yoo, Sehoon YR 2024 K1 Gold K1 Power lasers K1 Surface emitting lasers K1 Palladium K1 Surface finishing K1 Bonding K1 Surface treatment K1 ultra-fine pitch bonding K1 laser-assisted bonding K1 thermo-compression bonding K1 Ni-less surface finish K1 direct palladium immersion gold (DPIG) SP 85 OP 86 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535432 DO https://doi.org/10.23919/ICEP61562.2024.10535432 SF ELIB - SuUB Bremen
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