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1 Ergebnisse
1
Thermo-Mechanical Reliability of Ag Porous Sheet Bonding St..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Kim, Dongjin
;
Kim, YehRi
;
Jo, Eunjin
... - p. 149-150 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535534
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Thermo-Mechanical Reliability of Ag Porous Sheet Bonding Structures</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535534&Exemplar=1&LAN=DE A1 Kim, Dongjin A1 Kim, YehRi A1 Jo, Eunjin A1 Kim, Seoah A1 Park, Jiyong A1 Ko, Yong-Ho YR 2024 K1 Thermal factors K1 Thermomechanical processes K1 Aging K1 Plating K1 Electronic packaging thermal management K1 Robustness K1 Bonding K1 Ag porous sheet K1 thermo-mechanical reliability K1 SiC MOSFET K1 power module SP 149 OP 150 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535534 DO https://doi.org/10.23919/ICEP61562.2024.10535534 SF ELIB - SuUB Bremen
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