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1 Ergebnisse
1
Dendrite Formation in Power Electronics Packages during HV-..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Steiner, Felix
;
Blank, Thomas
;
Ishikawa, Dai
. - p. 31-32 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535544
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Dendrite Formation in Power Electronics Packages during HV-H3TRB Testing due to Flux Residue</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535544&Exemplar=1&LAN=DE A1 Steiner, Felix A1 Blank, Thomas A1 Ishikawa, Dai A1 Nakako, Hideo YR 2024 K1 Performance evaluation K1 Surface cleaning K1 Silver K1 Surface resistance K1 Surface contamination K1 Multichip modules K1 Dendrites (neurons) K1 HV-H3TRB K1 Metal dendrites K1 power electronics K1 packaging K1 reliability SP 31 OP 32 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535544 DO https://doi.org/10.23919/ICEP61562.2024.10535544 SF ELIB - SuUB Bremen
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